We are proficient with PCB substrates including rigid board, flex circuit, and rigidflex hybrid circuits. Flexible component placement solutions include surface mount technology (SMT), plated thru-hole technology (PTH, THT) and mixed technology assemblies.
Our automated and manual assembly technologies and techniques allow us to handle manufacturing solutions for our customers ranging from small to medium and large production runs.
Printed Circuit Assembly Capabilities
Surface Mount Technology (SMT)
Plated Through Hole Technology (THT/PTH)
Mixed Technology (SMT, THT/PTH)
Lead and Lead-Free (RoHS)
No-Clean and Clean Fluxes
Single and Double-Sided Component Placement
Conformal Coating
Printed Circuit Board Construction
Rigid
Flexible
Rigid-Flex Hybrid
Single and Multilayer
Thickness: Min. = 0.015” / Max. = 0.235”
Dimensions: Maximum Array = 20” x 20
Component Specifications
Standard 0201 Packages: Up To 2.913” Square
01005 Placements Capable
Maximum Component Height = 0.787”
Fine Pitch, BGA, uBGA, QFN, POP, and Leadless
