We are proficient with PCB substrates including rigid board, flex circuit, and rigidflex hybrid circuits. Flexible component placement solutions include surface mount technology (SMT), plated thru-hole technology (PTH, THT) and mixed technology assemblies.Our automated and manual assembly technologies and techniques allow us to handle manufacturing solutions for our customers ranging from small to medium and large production runs.
Printed Circuit Board (PCB) fabrication is a key process in modern electronics manufacturing. It involves creating conductive circuits on an insulating substrate to connect and support electronic components. Almost every electronic device, from smartphones to industrial equipment, relies on high-quality PCBs.
Printed Circuit Board (PCB) fabrication is a key process in modern electronics. It turns digital circuit designs into physical platforms, connecting electronic components and supporting the normal operation of almost all devices (smartphones, automotive systems, etc.).
Bittele has a well-established, effective component sourcing system for low cost PCB Assembly. At your disposal, we have a professional staff with years of expertise in managing the purchasing and coordination of PCB parts. We endeavor to help you solve any Component Issues prior to your order placement. Only the components that you specify in your BOM are ordered for every one of your assembly orders.
Box Build, also known as system assembly, is a critical end-to-end manufacturing process in electronics. It integrates PCBA, mechanical components, cables, and software into a complete, functional finished product—from prototype assembly to high-volume production. As a one-stop solution, it streamlines manufacturing workflows and ensures product consistency for diverse industries.
SMT Assembly, short for Surface Mount Technology Assembly, is a pivotal precision manufacturing process that mounts electronic components directly onto the surface of printed circuit boards (PCBs). As the backbone of modern electronics production, it has replaced traditional through-hole assembly due to its ability to handle miniaturized components, enable high-density packaging, and boost production efficiency—making it essential for nearly all electronic devices, from smartphones and wearables to industrial controllers and automotive electronics.
