BGA (Ball Grid Array) is a high-density surface-mount packaging technology used for integrated circuits (ICs) on PCBs, featuring solder balls arranged in a grid pattern on the bottom of the IC package.
Compared with traditional packaging, it offers higher pin density, better heat dissipation, and improved electrical performance, effectively solving the problem of limited pin count in small IC packages.
It is widely used in high-performance electronic devices such as computers, smartphones, and industrial controllers, requiring precise soldering processes to ensure reliable connections between the IC and PCB.
